This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.

The rate of change in AI algorithms complicates the decision-making process about what to put in software, and how flexible ...

A new technical paper titled “Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Power architect Barry Pangrle looks ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Clock Modulation Covert Channel” was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and Université ...

Experts at the Table: Semiconductor Engineering sat down to discuss the causes of chip failures, how to respond to them, and how that can change over time, with Steve Pateras, vice president of ...

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

Along with showing excellent electrical conductivity, the printed fabrics continued to perform well after 20 cycles of ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...